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8
4955C–AUTO–09/07
ATA6839 [Preliminary]
5. Thermal Resistance
4. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
All values refer to GND pins.
Parameters Pin Symbol Value Unit
Supply voltage V
VS
–0.3 to +40 V
Supply voltage t < 0.5s; I
S
>–2A V
VS
–1 V
Supply voltage difference
V
S_pin5
–V
S_pin10
V
VS
150 mV
Logic supply voltage V
VCC
–0.3 to +7 V
Logic input voltage V
DI,
V
CLK,
V
CS
–0.3 to V
VCC
+0.3 V
Logic output voltage V
DO
–0.3 to V
VCC
+0.3 V
Input current I
INH,
I
DI,
I
CLK,
I
CS
–10 to +10 mA
Output current I
DO
–10 to +10 mA
Output current I
OUT1
to I
OUT6
Internally limited, see
“Output Specification” in
Section 7. on page 9
Junction temperature range T
j
–40 to +200 °C
Storage temperature range T
STG
–55 to +200 °C
Ambient temperature range
T
a
–40 to +150 °C
Table 5-1. QFN24: Depends on the PCB-board
Parameter Test Conditions Pin Symbol Min. Typ. Max. Unit
Junction pin R
thJP
< 5 K/W
Junction ambient R
thJA
35 K/W
6. Operating Range
Parameter Test Conditions Pin Symbol Min. Typ. Max. Unit
Supply voltage V
VS
V
UV
(1)
40 V
Logic supply voltage V
VCC
35.5V
Logic input voltage
V
INH,
V
DI,
V
CLK,
V
CS
–0.3 V
VCC
V
Serial interface clock
frequency
f
CLK
2MHz
Junction temperature
range
T
j
–40 +200 °C
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